Professor Martin Byung-Guk Jun from Purdue University Mechanical Engineering Department Visit
Honorable distinction of being a finalist for the 2023 R&D 100 Award
SEMICON Taiwan 2023 - HAR TSV Measurement Equipment Workshop
SEMICON Taiwan 2023 - Semiconductor Advanced Inspection and Metrology Forum
The TGV 3D Viewer is the optimal solution for measuring Through Glass Via (TGV) side-wall profile, roughness, top/middle/bottom CD, roundness, via axis perpendicularity, and cylindricity. It is the most powerful non-destructive equipment on the market, capable of inspecting laser-induced glass modification defects (before etching), via etching defects, center deviation, and via waist height variation.
Function: automatic measurement for TSV depth; oxide, nitride, PR, PI film thickness; wafer profile
Function: automatic measurement for TSV / deep-trench depth; oxide, nitride, PR, PI film thickness; wafer profile; wafer tilt angle
Function: automatic measurement for oxide, nitride, PR, PI film thickness; wafer profile
Nondestructive model-based TSV bottom feature characterization
Metal pillar height inspection tool
Non destructive measurement services for Si / SiC / Glass fabrication processes
The TGV C100 is a tabletop TGV (Through Glass Via) metrology tool. It is a manual or semi-automatic TGV inspection system, useful for research activities.
Ultra high-speed TSV sensor head module
