ViaMaster A100
Function: automatic measurement for TSV depth; oxide, nitride, PR, PI film thickness; wafer profile
Honorable distinction of being a finalist for the 2023 R&D 100 Award
SEMICON Taiwan 2023 - HAR TSV Measurement Equipment Workshop
SEMICON Taiwan 2023 - Semiconductor Advanced Inspection and Metrology Forum
ViaMaster A200
Function: automatic measurement for TSV depth; oxide, nitride, PR, PI film thickness; wafer profile; wafer tilt angle
Film Metrology Unit
Function: automatic measurement for oxide, nitride, PR, PI film thickness; wafer profile
TSV bottom feature analyzer
Nondestructive model-based TSV bottom feature characterization
Metal pillar height inspection tool
Metal pillar height inspection tool
Non destructive measurement services
Non destructive measurement services for Si / SiC / Glass fabrication processes
TGV C100
Table-top TGV (Through Glass Via) metrology tool
Automatic TGV inspection system
TSV inspection module
Ultra high-speed TSV sensor head module
OmniMeasure Technology's team has years of experience in developing modules and equipment for critical dimension inspection and metrology of wafers, substrates, coatings, and etching in the
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