ViaMaster A100
Function: automatic measurement for TSV depth; oxide, nitride, PR, PI film thickness; wafer profile
- Spot size (3 options): 50μm、25μm、7μm
- TSV aspect ratio: >30 @ Top CD 3~5 μm
- TSV depth Repeatability: < 0.2 μm (for depth 170 μm)
- Film thickness range: 500 Å ~ 30 μm
- Wafer stage XYZA (4 DOF)