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SEMICON Taiwan 2023 - HAR TSV Measurement Equipment Workshop4
http://www.omsure.com/ OminiMeasure Technology
OminiMeasure Technology Room 102, Building 1, No. 321, Section 2, Guangfu Road, Hsinchu City, Taiwan
Professor Martin Byung-Guk Jun of Purdue University's School of Mechanical Engineering visited OmniMeasure Technology's  to see industry-leading TSV metrology equipment.The visit focused on innovative technologies for TSV inspection, crucial for ensuring the reliability of 3D integrated circuits (3D IC).OmniMeasure Technology's demonstrated metrology system, showcasing the equipment's exceptional precision and efficiency. This exchange has laid a solid foundation for future cooperation between the two sides in related fields. http://www.omsure.com/hot_503713.html Professor Martin Byung-Guk Jun from Purdue University Mechanical Engineering Department Visit 2024-11-20 2025-11-20
OminiMeasure Technology Room 102, Building 1, No. 321, Section 2, Guangfu Road, Hsinchu City, Taiwan http://www.omsure.com/hot_503713.html
OminiMeasure Technology Room 102, Building 1, No. 321, Section 2, Guangfu Road, Hsinchu City, Taiwan http://www.omsure.com/hot_503713.html
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2024-11-20 http://schema.org/InStock TWD 0 http://www.omsure.com/hot_503713.html

SEMICON Taiwan 2023 - HAR TSV Measurement Equipment Workshop

OmniMeasure will present a powerful TSV inspection equipment that is going to save 3D IC yield before putting 80 % cost in TSV process.

Time:

  • Session A: 2023.09.06,14:00 – 14:30
  • Session B: 2023.09.07,11:00 – 11:30

Location: 

  • N0476, 4F, Hall 1, Taipei Nangang Exhibition Center (台北南港展覽館1館4樓)
2023 SEMICON Taiwan-2023/9/6~9/8 | 穎崴科技股份有限公司

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