Professor Martin Byung-Guk Jun of Purdue University's School of Mechanical Engineering visited OmniMeasure Technology's to see industry-leading TSV metrology equipment.
The visit focused on innovative technologies for TSV inspection, crucial for ensuring the reliability of 3D integrated circuits (3D IC).
OmniMeasure Technology's demonstrated metrology system, showcasing the equipment's exceptional precision and efficiency. This exchange has laid a solid foundation for future cooperation between the two sides in related fields.