Test Research, Inc. (TRI) and its SEMI inspection partner OmniMeasure will present the latest technologies at the "Semiconductor Advanced Packaging and Measurement Forum" during SEMICON Taiwan 2024. The forum will be held on September 6 (Friday) from 8:30 AM to 4:20 PM at the Taipei Nangang Exhibition Center, Hall 1, 4th Floor.

Dr. Hung-Ming Tai, CTO of OmniMeasure, will deliver a presentation on the "Wafer-level Inspection System for High Aspect-Ratio TSV in Heterogenous Integration Packaging" at the forum. During the presentation, TRI's advanced WLP/PLP and backend testing solutions will also be showcased. For more details about OmniMeasure's presentation, please visit the forum's related page.

You are warmly invited to visit TRI's booth (Booth No.: N0990) to witness how the TSV (Through Silicon Via) measurement module supports TRI's TR7950Q Sll wafer testing and measurement solutions. In addition, OmniMeasure will also showcase powerful TGV (Through Glass Via) inspection solutions at their booth.

About Test Research, Inc. (TRI)

Test Research, Inc. (TRI) offers a comprehensive and cost-effective product portfolio to meet various manufacturing testing and inspection needs. For more details, please visit the TRI official website at http://www.tri.com.tw. For sales and service inquiries, please contact us at marketing@tri.com.tw or call +886-2-2832 8918.

About OmniMeasure Technology Inc.

OmniMeasure Technology Inc. focuses on advanced modules and equipment for critical dimension measurement and metrology in semiconductor manufacturing. OmniMeasure has a team of experts dedicated to improving process quality and efficiency in the global semiconductor and optoelectronics industries. The company specializes in HPC, AI, 3D IC chip design, and advanced packaging technologies. OmniMeasure provides semiconductor inspection systems, testing services, and optical instruments. For more information, please visit www.omsure.com or contact info@omsure.com.