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TSV inspection module3
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TSV inspection module

Ultra high-speed TSV sensor head module


Function: sensing TSV depth; trench depth; oxide, nitride, PR, PI film thickness

Specifications:

Model name

Hivia

Horus

Horus Zoom*1

Horus HA*2

Horus Fast*3

Via aspect ratio*4

15
(at 5 µm via)

30
(at 3 µm via)

30
(at 3 µm via)

40
(at 3 µm via)

35
(at 5 µm via)

Reference distance

23±1 mm

23±1 mm

23±1 mm

23±1 mm

23±1 mm

Preferable TSV diameter*5 (recommended)

5~20 µm

3~5 µm

2.5~3 µm

2.5~5 µm

3~10 µm

Repeatability on depth*6

<0.3 µm

<0.2 µm

<0.2 µm

<0.2 µm

<0.2 µm

Sampling time (per acquisition)

1 sec

200 msec

300 msec

300 msec

100 msec

Smart light source status monitoring

Optional

Yes

Yes

Yes

Yes

Weight (main)

1 kgw

1 kgw

1 kgw

1 kgw

1 kgw

Operation indicator

LED indicator on the light source

Light source

VIS to NIR 

Power Requirements

Light source: 7.5 V (max 45 W, 6 A); Camera: 2.7 W(max); Optical sensor : USB 5 V (max 2.5 W, 0.5 A)

Ambient temperature

20–25 °C 

Humidity

20–75 %, relative, non-condensing

Material

Metal housing with anodizing anti-oxidation



Note1,2,3:Customized model. Contact us for other designs.
Note4:For the via holes with proper etch quality.
Note5:Contact us for smaller via diameter.
Note6:Validated on reference samples with 170 µm depth.

Please contact with us for details or other specifications.
1591433