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TSV inspection module3
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TSV inspection module

Ultra high-speed TSV sensor head module


Function: sensing TSV depth; trench depth; oxide, nitride, PR, PI film thickness

Specifications:

Model name

Hivia

Horus

Horus Zoom*1

Horus HA*2

Horus Fast*3

Via aspect ratio*4

15
(at 5 mm via)

30
(at 3 mm via)

30
(at 3 mm via)

40
(at 3 mm via)

35
(at 5 mm via)

Reference distance

23±1 mm

23±1 mm

23±1 mm

23±1 mm

23±1 mm

Preferable TSV diameter*5 (recommended)

5~20 mm

3~5 mm

2.5~3 mm

2.5~5 mm

3~10 mm

Repeatability on depth*6

<0.3 mm

<0.2 mm

<0.2 mm

<0.2 mm

<0.2 mm

Sampling time (per acquisition)

1 sec

200 msec

300 msec

300 msec

100 msec

Smart light source status monitoring

Optional

Yes

Yes

Yes

Yes

Weight (main)

1 kgw

1 kgw

1 kgw

1 kgw

1 kgw

Operation indicator

LED indicator on the light source

Light source

VIS to NIR 

Power Requirements

Light source: 7.5 V (max 45 W, 6 A); Camera: 2.7 W(max); Optical sensor : USB 5 V (max 2.5 W, 0.5 A)

Ambient temperature

0–50 °C (32–122 °F)

Humidity

20–80 %, relative, non-condensing

Material

Metal housing with anodizing anti-oxidation



Note1,2,3:Customized model. Contact us for other designs.
Note4:For the via holes with proper etch quality.
Note5:Contact us for smaller via diameter.
Note6:Validated on reference samples with 170 mm depth.

Please contact with us for details or other specifications.
1591433