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ViaMaster A100 ViaMaster A100 https://www.omsure.com/product_1591434.html Specifications：Spot size (3 options): 50μm、25μm、7μm TSV aspect ratio: >30 @ Top CD 3~5 μm TSV depth Repeatability: < 0.2 μm (for depth 170 μm) Film thickness range: 500 Å ~ 30 μm Wafer stage XYZA (4 DOF) 1591434
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Specifications：Spot size (3 options): 50μm、25μm、7μm TSV aspect ratio: >30 @ Top CD 3~5 μm TSV depth Repeatability: < 0.2 μm (for depth 170 μm) Film thickness range: 500 Å ~ 30 μm Wafer stage XYZA (4 DOF)
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USD http://schema.org/InStock https://www.omsure.com/product_1591434.html 2024-03-14 0
ViaMaster A100
Film Metrology Unit Film Metrology Unit https://www.omsure.com/product_1591435.html •Specification： •Spot size (3 options): 50μm、25μm、7μm •Film thickness range: 500 Å ~ 30 μm •Wafer stage : Customised 1591435
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•Specification： •Spot size (3 options): 50μm、25μm、7μm •Film thickness range: 500 Å ~ 30 μm •Wafer stage : Customised
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USD http://schema.org/InStock https://www.omsure.com/product_1591435.html 2024-03-14 0
Film Metrology Unit
ViaMaster A200 ViaMaster A200 https://www.omsure.com/product_1591436.html •Specifications： •Spot size (3 options): 50μm、25μm、7μm •TSV aspect ratio: >30 @ Top CD 3~5 μm •TSV depth Repeatability: < 0.2 μm (for depth 170 μm) •Film thickness range: 500 Å ~ 30 μm •Wafer stage XYZabg (6 DOF)，adjustable wafer tilt angle 1591436
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•Specifications： •Spot size (3 options): 50μm、25μm、7μm •TSV aspect ratio: >30 @ Top CD 3~5 μm •TSV depth Repeatability: < 0.2 μm (for depth 170 μm) •Film thickness range: 500 Å ~ 30 μm •Wafer stage XYZabg (6 DOF)，adjustable wafer tilt angle
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USD http://schema.org/InStock https://www.omsure.com/product_1591436.html 2024-03-14 0
ViaMaster A200
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