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TSV bottom feature analyzer3
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TSV bottom feature analyzer

Nondestructive model-based TSV bottom feature characterization

(1) Grab reflective signals and automatic estimate key dimensions of the bottom, or detect differences between vias (uniformity)

(2) Dimensions of the via bottom: long axis (a) and short axis (b) of the bottom shape

(3) Wafer: 8 inch and 12 inch  1591441