Ultra high-speed TSV sensor head module
Function: sensing TSV depth; trench depth; oxide, nitride, PR, PI film thickness
Specifications:
Model name |
Hivia |
Horus |
Horus Zoom*1 |
Horus HA*2 |
Horus Fast*3 |
Via aspect ratio*4 |
15 |
30 |
30 |
40 |
35 |
Reference distance |
23±1 mm |
23±1 mm |
23±1 mm |
23±1 mm |
23±1 mm |
Preferable TSV diameter*5 (recommended) |
5~20 mm |
3~5 mm |
2.5~3 mm |
2.5~5 mm |
3~10 mm |
Repeatability on depth*6 |
<0.3 mm |
<0.2 mm |
<0.2 mm |
<0.2 mm |
<0.2 mm |
Sampling time (per acquisition) |
1 sec |
200 msec |
300 msec |
300 msec |
100 msec |
Smart light source status monitoring |
Optional |
Yes |
Yes |
Yes |
Yes |
Weight (main) |
1 kgw |
1 kgw |
1 kgw |
1 kgw |
1 kgw |
Operation indicator |
LED indicator on the light source |
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Light source |
VIS to NIR |
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Power Requirements |
Light source: 7.5 V (max 45 W, 6 A); Camera: 2.7 W(max); Optical sensor : USB 5 V (max 2.5 W, 0.5 A) |
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Ambient temperature |
0–50 °C (32–122 °F) |
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Humidity |
20–80 %, relative, non-condensing |
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Material |
Metal housing with anodizing anti-oxidation |
Note1,2,3:Customized model. Contact us for other designs.
Note4:For the via holes with proper etch quality.
Note5:Contact us for smaller via diameter.
Note6:Validated on reference samples with 170 mm depth.
Please contact with us for details or other specifications.