|
Time |
Events |
|
2010.01 |
Core patent and intellectual properties established. |
|
2012.03 |
US patent granted. |
|
2013.09 |
Core patent and intellectual properties issued. |
|
2014.04 |
US patent granted. |
|
2014.06 |
Core patent and intellectual properties issued. |
|
2017.09 |
US patent granted. |
|
2017.10 |
Core patent and intellectual properties issued. |
|
2019.12 |
Inspection module adopted by international corporations |
|
2022.05 |
The team received support from the Ministry of Economic Affairs and the Ministry of Science and Technology's technology project. |
|
2022.09 |
The team won the Ministry of Economic Affairs' Industry Technology Innovation Award. |
|
2022.10 |
The team won the Taiwan Innotech Expo Award. |
|
2022.10 |
The team won the Ministry of Economic Affairs' TREE Award 2022. |
|
2023.05 |
The team won the ITRI’ Research Award 2022. |
|
2023.08 |
The team's product is a finalist for the 2023 R&D 100 Award |
|
2024.01 |
Company registration establishment. |
|
2024.03 |
A new electrical design and 3D simulation platform, developed in collaboration with SolidWorks Inc., was set up. |
|
2024.03 |
TSV metrology modules were purchased by a leading IC packaging equipment provider. |
|
2024.07 |
Intelligent multi-channel Xenon light source modules were developed and purchased by a semiconductor equipment provider. |
| 2024.08 | Novel Through Glass Via (TGV) metrology equipment was announced to the market. |
| 2024.08 | OmniMeasure was reported by Semiconductor Review Magazine. |