Automatic TSV (Through Silicon Via) / Deep Trench inspection system ViaMaster A200
Function: automatic measurement for TSV /deep-trench depth; oxide, nitride, PR, PI film thickness; wafer profile; wafer tilt angle
•Specifications：
|
System Model |
ViaMaster A200 |
|
Wafer size |
12 in. |
|
Inspection items |
TSV(f2.5~5mm)*2, CD, overlay, step height, wafer profile, wafer thickness, wafer tilt; 3D map visualization |
|
Light source |
LED & wide band lighting & laser |
|
Working distance (for multi lens) |
Min 12mm, Max 65mm |
|
Lens |
4X, 20X (or other selections), confocal, tilt sensor |
|
Chuck |
Wafer lift pin (or Customized) and vacuum |
|
Air |
VAC -80kPa，CDA 5~7kg/cm^2 |
|
System configuration |
XYZABC (450x350x60mm, 1° 1° 4°) with linear scales 1um resolution |
|
Electrostatic discharger |
600mm |
|
Cleanliness |
Class 100 |
|
Networking |
SECS/GEM |
|
Main controller |
Windows 11 with height-speed USB, 4-port GbE card |
|
System power |
220VAC |
|
Safety compatibility |
SEMI S2 |
Note2: The specifications may vary depending on the model of the inspection head module you select. Contact us for other needs.