Automatic TSV (Through Silicon Via) inspection system ViaMaster A100
Function: automatic measurement for TSV depth; oxide, nitride, PR, PI film thickness; wafer profile
ViaMaster A100
Specifications：
|
System Model |
ViaMaster A100 |
|
Wafer size |
8 in. (or 12 in. option) |
|
Inspection items |
TSV (f3~5mm)*1, CD, step height, wafer profile, wafer thickness; 3D map visualization |
|
Light source |
LED & wide band lighting |
|
Working distance (for multi lens) |
Min 12mm, Max 65mm |
|
Lens |
4X, 20X (or other selections), confocal |
|
Chuck |
Standard (or Customized) and vacuum |
|
Air |
VAC -80kPa，CDA 5~7kg/cm^2 |
|
System configuration |
XYZC (400x350x10mm, 360°) with linear scales 1um resolution |
|
Electrostatic discharger |
600mm |
|
Cleanliness |
Class 100 |
|
Networking |
SECS/GEM |
|
Main controller |
Windows 11 with height-speed USB, 4-port GbE card |
|
System power |
220VAC |
|
Safety compatibility |
SEMI S2 |
Note1: The specifications may vary depending on the model of the inspection head module you select. Contact us for other needs.