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Time
Events
2010.01
Core patent and intellectual properties established.
2012.03
US patent granted.
2013.09
Core patent and intellectual properties issued.
2014.04
US patent granted.
2014.06
Core patent and intellectual properties issued.
2017.09
US patent granted.
2017.10
Core patent and intellectual properties issued.
2019.12
Inspection module adopted by international corporations
2022.05
The team received support from the Ministry of Economic Affairs and the Ministry of Science and Technology's technology project.
2022.09
The team won the Ministry of Economic Affairs' Industry Technology Innovation Award.
2022.10
The team won the Taiwan Innotech Expo Award.
2022.10
The team won the Ministry of Economic Affairs' TREE Award 2022.
2023.05
The team won the ITRI’ Research Award 2022.
2023.08
The team's product is a finalist for the 2023 R&D 100 Award
2024.01
Company registration establishment.
2024.03
A new electrical design and 3D simulation platform, developed in collaboration with SolidWorks Inc., was set up.
2024.03
TSV metrology modules were purchased by a leading IC packaging equipment provider.
2024.07
Intelligent multi-channel Xenon light source modules were developed and purchased by a semiconductor equipment provider.
2024.08
Novel Through Glass Via (TGV) metrology equipment was announced to the market.
2024.08
OmniMeasure was reported by Semiconductor Review Magazine.